STM32 MPU OpenSTLinux release note - v6.0.0

Applicable for

STM32MP13x lines  STM32MP15x lines  STM32MP23x lines  STM32MP25x lines

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This article describes the content of OpenSTLinux distribution software release version ecosystem release v6.0.0 , which is part of the STM32 MPU ecosystem release note - v6.0.0.

1. Intended audience

The targeted audience is STM32MP1 series and STM32MP25x lines  customers or partners.

2. Delivery scope and purpose

The OpenSTLinux distribution is a Linux^® distribution based on the OpenEmbedded build Framework. It runs on the Arm^® Cortex^® processors, and is a fundamental part of the STM32MPU Embedded Software distribution. This delivery of OpenSTLinux distribution is part of STM32 MPU Ecosystem v6.0.0 (see the STM32 MPU ecosystem release note - v6.0.0).

3. Licensing

This software package is licensed under a LIMITED LICENSE AGREEMENT FOR ST MATERIALS EVALUATION (LLA). Customers may not use this package except in compliance with the software license agreement (SLA).

All packages use the same source components. All components and their respective licenses are listed here.

4. Supported hardware

This software delivery is compatible with the following boards:

STM32MP13 boards
Boards	PCBs list	Main features	Ordering
STM32MP135F-DK Discovery kit	MB1635 (motherboard) MB1897 (camera module board)	STM32MP135FAF7 Rev.Y Arm®-based Cortex®-A7 1 GHz Secure boot and cryptography 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1D 4.3" TFT 480x272 pixels with LED backlight, and capacitive touch panel 2-megapixel dual lane CSI-2 camera module with 15-pin FFC connector Wi-Fi® 802.11b/g/n Bluetooth® Low Energy 4.1	Discovery kit with STM32MP135F MPU

STM32MP15 boards
Boards	PCBs list	Main features	Ordering
STM32MP157D-DK1 Discovery kit	MB1272C (motherboard)	STM32MP157DAC1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Basic security 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1A cut2.0	Discovery kit with STM32MP157D MPU
STM32MP157F-DK2 Discovery kit	MB1272C (motherboard) MB1407B (daughterboard DSI display)	STM32MP157FAC1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Secure boot and cryptography 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1A cut2.0 4" TFT 480×800 pixels with LED backlight, and capacitive touch panel Wi-Fi® 802.11b/g/n Bluetooth® Low Energy 4.1	Discovery kit with STM32MP157F MPU
STM32MP157D-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157DAA1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Basic security 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1A cut2.0 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Evaluation board with STM32MP157D MPU
STM32MP157F-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157FAA1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Secure boot and cryptography 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1A cut2.0 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Evaluation board with STM32MP157F MPU
STM32MP157A-DK1 Discovery kit	MB1272C (motherboard)	STM32MP157AAC3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Basic security 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1A cut1.2	Out of production
STM32MP157C-DK2 Discovery kit	MB1272C (motherboard) MB1407B (daughterboard DSI display)	STM32MP157CAC3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Secure boot and cryptography 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1A cut1.2 4" TFT 480×800 pixels with LED backlight, and capacitive touch panel Wi-Fi® 802.11b/g/n Bluetooth® Low Energy 4.1	Out of production
STM32MP157A-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157AAA3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Basic security 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1A cut1.2 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Out of production
STM32MP157C-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157CAA3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Secure boot and cryptography 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1A cut1.2 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Out of production

STM32MP23 boards
Important To help you get started with STM32MP23x product lines evaluation, you can rely on the STM32MP257F-DK Discovery kit and applicable piece of STM32 MPU embedded software to run with STM32MP23 characteristics (peripherals, features, and performances).

STM32MP25 boards
Boards	PCBs list	Main features	Ordering
STM32MP257F-EV1 Evaluation board	MB1936 (main board)	STM32MP257FAI3 Rev.Y Arm®-based dual Cortex®-A35 1500 MHz Secure boot and cryptography 2 x 16-Gbit DDR4, 32 bits, 1200 MHz PMIC STPMIC25 Cut1.1 Optional expansion boards LVDS WSVGA display B-LVDS7-WSVGA board 5-megapixel image sensor raw Bayer B-CAMS-IMX board DSI to HDMI adapter Full HD 30fps B-LCDAD-HDMI1 board	Evaluation board with STM32MP257F MPU
STM32MP257F-DK Discovery kit	MB1605 (main board)	STM32MP257FAK3 Rev.Y Arm®-based dual Cortex®-A35 1500 MHz Secure boot and cryptography 32-Gbit LPDDR4, 32 bits, 1200 MHz PMIC STPMIC25 Cut1.1 Optional expansion boards LVDS WSVGA display B-LVDS7-WSVGA board 5-megapixel image sensor raw Bayer B-CAMS-IMX board	Discovery kit with STM32MP257F MPU

5. Release content

5.1. Main software components

• Build process
  • OpenEmbedded v5.0.3 (Scarthgap) - Updated
  • GCC version v13.3.0 - Updated
• Embedded software components
  • Linux kernel v6.6-stm32mp-r1 (v6.6.48) - Updated
  • TF-A v2.10-stm32mp-r1 - Updated
  • U-Boot v2023.10-stm32mp-r1 - Updated
  • OP-TEE 4.0.0-stm32mp-r1 - Updated
  • External DT 6.0-stm32mp-r1 - Updated
  • OpenOCD version v0.12.0
• Applicative components
  • Weston version v13.0.1 - Updated
  • Wayland version 1.22.0 - Updated
  • GStreamer version v1.22.12 - Updated
  • GCnano version v6.4.19 - Updated

5.2. Changes

5.2.1. OpenSTLinux layers

Changes are:‎

• Rebase on Yocto Release 5.0.3 (Scarthgap)
• Support of STM32MP23x lines 
• CONF/MACHINE
  • Add new machine stm32mp23-disco (applicable on STM32MP257F-DK Discovery kit for STM32MP23x lines evaluation )
  • Add new boot device storage for NAND-SDCARD storage
    • Nand-4-256-1024-sdcard (FMC NAND )
    • Nand-4-256-512-sdcard (SPI NAND )
    • Nand-2-128-256-sdcard (SPI NAND )
  • Add support of new boot scheme to match with OP-TEE profiles
    • BOOTSCHEME_LABELS += "opteemin" for system_services
    • BOOTSCHEME_LABELS += "optee" for secure_and_system_services
• Libcamera: add ipa (plugins) for dcmipp
• Splashcreen; add animated splashscren
• Minor fixes

5.2.2. Linux kernel

New component release tag v6.6-stm32mp-r1 is available.

The main features updated are:

• Rebased on Linux^® kernel v6.6.48 for OpenSTLinux v6.0 delivery
• Add STM32MP23x lines  support
• Add support of STM32MP257F-DK Discovery kit for STM32MP23x lines evaluation
• Add Cortex M0+ support
• Low power improvement (OSI, pm_runtime and wake-up support in drivers)
• Secure RTC driver
• OSPI HYPERFLASH: add the support of second and third source
• Dual LVDS panel mode
• DCMIPP support RGB32 pixel format
• DCMIPP : Add TPG support
• VDEC WebP support
• VDEC MJPEG support
• Add GPU power domains

• Minor fixes

5.2.3. U-Boot

New component release tag v2023.10-stm32mp-r1 is available, rebased on official U-Boot v2023.10.

Changes are:

• Rebase on U-Boot v2023.10 for OpenSTLinux v6.0 delivery
• Add STM32MP23x lines  support
• Add support of STM32MP257F-DK Discovery kit for STM32MP23x lines evaluation
• Add mmc0 boot target for nand or spi-nand boot on ST boards
• Fix the used alias for BOOT RAMs on STM32MP25x lines 
• LTDC: Support of rotation on crtc output

• Other minor updates

5.2.4. TF-A

New component release tag v2.10-stm32mp-r1 is available, rebased on official TF-A v2.10 (LTS tag lts-v2.10.15).

Changes are:

• Rebase on LTS-v2.10.5
• STM32MP23x lines  support
• Add support of STM32MP257F-DK Discovery kit for STM32MP23x lines evaluation

• Add support of STPMIC1L and STPMIC2L
• Multiples fix and improvement

Full changelog: lts-v2.10.5...2.10-stm32mp-r1

5.2.5. OP-TEE

New component release tag 4.0.0-stm32mp-r1 is available, rebased on official OP_TEE OS 4.0.0.

Changes are:

• Rebase on OP-TEE 4.0.0 for OpenSTLinux v6.0.0
  • Use upstreamed firewall framework from OP-TEE 4.3.0
• Introduction of STM32MP23 platform
• Add support of STM32MP257F-DK Discovery kit for STM32MP23x lines evaluation
• Support of STPMIC2L
• SCMI server description in device tree for STM32MP2x
• Other minor updates

Full Changelog: 4.0.0...4.0.0-stm32mp-r1

5.2.6. External-DT

New component release tag v6.0-stm32mp-r1 is available to take into account rebase of OpenSTLinux V6.0.0. It also includes multiples fix and improvements.

The external device tree component is used to host STM32 MPU embedded software device tree configurations in addition of the ones present in each software component (TF-A, OP-TEE, U-BOOT, LINUX, TF-M). It is Used for STM32MP25x lines , but not yet for STM32MP1 series.

6. Release change notification

OpenSTLinux attention points to switch from ecosystem release v5.1.0 to ecosystem release v6.0.0 are documented in STM32 MPU OpenSTLinux release changes notification – v6.0.0 article.

7. Recommendations for use

7.1. Safe use

• Flash programming and boot from all supported flash devices: SD card, eMMC, ONFI NAND and NOR flash memories.
• Develop Linux^® applications, libraries, kernel modules based on OpenSTLinux delivery.
• Develop coprocessor Cube applications based on STM32CubeMP1 and STM32CubeMP2 deliveries.
• Develop boards based on STM32MP1 series and STM32MP2 series.
• Prototype applications based on ST boards.

7.2. Non-recommended use

• None

8. Restrictions

STM32MP1 series

• The partition layout always keeps the Firmware Update related partitions even if machine feature fw-update is disabled. To optimize the partition layout without Firmware Update feature, modifications are needed on flashlayout file generation and also on U-Boot source code in case of MTD partitions (storage mapping is hardcoded for MTD partitions, see How_to_configure_U-Boot_for_your_board#MTD_partitions)

9. Minor release updates

STMicroelectronics regularly delivers corrections through github^® components which are U-Boot, OP-TEE, TF-A , Linux kernel .

The corrections can be incorporated into the STM32MPU Developer Package or Distribution Package (see below).

Two possibilities exist to update a Distribution Package:

• Update your existing Distribution Package:

Switch your Distribution Package to # github^® mode .

1. Use the devtool modify <recipe name> command to set up an environment. It fetches and unpacks the source code.
2. In the extracted source code, use a git command such as git checkout -b WORK <github^® TAG> to point to a new revision of the component.

More rarely, STMicroelectronics also delivers fixes on layers through github^®. These changes can be integrated (via git commands: git checkout -b WORK <github^® commit SHA1>) into the local STM32MPU Distribution Package environment. See below the github^® links of the quoted layers :

• meta-st-stm32mp
• meta-st-openstlinux
• meta-st-stm32mp-addons

• Get a new Distribution Package:

Refer to Installing_the_OpenSTLinux_distribution page for installing instructions, and use the repo command given for the minor version below, if it exists.

10. How to get started with openstlinux-6.6-yocto-scarthgap-mpu-v24.11.06

Refer to How to download the software and start with this release?

11. Associated tools

Refer to the Referenced tools release notes .

12. Yocto features enabled in the delivery

OpenEmbedded build framework engine is named OE-Core.
OpenSTLinux distribution is based on the build framework OpenEmbedded, and can be configured thanks to a mechanism named "features" (machine features, distribution features, ...).

Depending on the features enabled, the resulting distribution can have more capabilities or software embedded.
For example, if the Wifi is enabled then the Wifi software and drivers are present on the filesystem and the Wifi can be used.

12.1. Machine features

The variable MACHINE_FEATURES specifies the list of hardware features the machine is capable of supporting.
These features (MACHINE_FEATURES) are defined inside the machine configuration .

Machine feature	Purpose
alsa	Include ALSA support (OSS compatibility kernel modules installed if available).
autoresize	Add support of autoresize through InitRD
bluetooth	Add Bluetooth firmware to the filesystem Broadcom43430 for (STM32MP135x-DK Discovery kit and STM32MP157x-DKx Discovery kit Broadcom43439 for (STM32MP257F-DK Discovery kit for STM32MP23x lines evaluation and STM32MP257F-DK Discovery kit )
ext2	Add Second Extended File System support
fip	Enable Firmware In Package (FIP) packaging format
fw-update	Enable Firmware update feature
gpu	Add GPU support (if EULA is accepted) (STM32MP157 line  and STM32MP2 series only)
initrd	Enable Intial ramdisk building
m4copro	Add m4projects to userfs (STM32MP15x lines  only)
m33copro	Add m33projects to userfs (STM32MP2 series only)
opencl	Add OpenCL for GPU support (if EULA is accepted) (STM32MP2 series only)
openvx	Add OpenVX for GPU support (if EULA is accepted) (STM32MP2 series only)
optee	Add OP-TEE Secure part
pci	Add Peripheral Component Interconnect peripheral support
rtc	Add Real Time Clock peripheral support
screen	Add display screen peripheral support
splashscreen	Add splashscreen to U-Boot
tpm2	Add Trusted Platform Module peripheral support
usbg0	Add G0 Firmware for USB support
usbgadget	Enable USB Gadget feature
usbhost	Enable USB Host feature
vulkan	Add Vulkan for GPU support (if EULA is accepted) STM32MP2 series only)
watchdog	Add watchdog support and binaries
wifi	Add Broadcom43430 (wifi) firmware to the filesystem (STM32MP135x-DK Discovery kit and STM32MP157x-DKx Discovery kit )

12.2. Distribution features

The variable DISTRO_FEATURES specifies the list of software features present in the distribution.
These features (DISTRO_FEATURES) are defined inside the distribution configuration .

Distribution feature	Purpose
alsa	Include ALSA support (OSS compatibility kernel modules installed if available).
argp
autoresize	Add support of userfs auto resize feature in OpenSTLinux
bluetooth	Include Bluetooth support
bluez5	Add Bluetooth stack
efi	Add userland EFI tools
ext2	Add Second Extended File System support
ext4	Add Fourth Extended File System support
gobject-introspection-data	Enable GObject Introspection, project for providing machine readable introspection data of the API of C libraries.
gplv3	Add gplv3 binaries in OpenSTLinux
gstreamer	Add gstreamer tools in filesystem
initrd	Add ramdisk
ipv4	Add ipv4 support
ipv6	Add ipv6 support
kde	Add several tools (e.g. cups, fontconfig, ...) to the filesystem
largefile	Enable large file support
ldconfig	Include support for ldconfig and ld.so.conf on the target
multiarch	Enable 64 bits BFD (Binary File Descriptor)
nfs	Include NFS client support (for mounting NFS exports on device).
opencl	Include the Open Graphics Library
opengl	Include the OpenCL Library
optee	Install tee service on the filesystem
pam	Enable Pluggable Authentication Module
pci	Add pci support
pulseaudio	Network-capable sound server program
splashscreen	Add U-Boot splashscreen
systemd	Use systemd as init service
usbgadget	USB Gadget Device support (for USB networking/serial/storage)
usbhost	USB Host support (allows to connect external keyboard, mouse, storage, network etc)
vulkan	Include the Vulkan Library
wayland	Add Wayland support
wifi	WiFi support
xattr	Add "Extended Attributes" support for filesystem
zeroconf	Add zeroconf package to set up a ad-hoc network

12.3. Bootscheme labels

The variable BOOTSCHEME_LABELS defines which kind of boot is supported on the board.
These settings (BOOTSCHEME_LABELS) are defined inside the machine configuration .

Bootscheme label	Purpose
optee	Add OP-TEE (System and secure services) in boot scheme
opteemin	Add OP-TEE (System services only) in boot scheme
fastboot	Add Fastboot and OP-TEE (System and secure services) in boot scheme
fastboot-opteemin	Add Fastboot and OP-TEE (System services only) in boot scheme

12.4. Bootdevice labels

The variable BOOTDEVICE_LABELS defines which kind of mass storage OpenSTLinux can program.
These settings (BOOTDEVICE_LABELS ) are defined inside the machine configuration .

Bootdevice label	Purpose
emmc	Add boot on eMMC device
nand-4-256-1024-sdcard	Add boot stage on NAND device and the filesystem on SD card
nor-sdcard	Add boot stage on NOR device and the filesystem on SD card
sdcard	Add boot on SD card

Linux^® is a registered trademark of Linus Torvalds.

Arm^® is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Cortex^®

Microprocessor unit

Power management integrated circuit

Light-emitting diode

MIPI camera serial interface 2 (MIPI^® Alliance standard)

Flexible flat cable

Technology for wireless local area networking with devices based on the IEEE 802.11 standards

Display serial interface (MIPI^® Alliance standard)

Low-voltage differential signaling (related to display interfaces) - NEW

High-definition multimedia interface (HDMI standard)

Trusted firmware for Arm^® Cortex^®-A

Das U-Boot -- the universal boot loader (see U-Boot)

Open portable trusted execution environment

Device tree

Open On-Chip Debugger (See https://www.openocd.org/ for more details)

Serial peripheral interface

Real time clock

Digital Camera memory interface pixel processor

Video decoder - NEW

Graphics processing units

LCD TFT display controller (STM32 specific)

Trusted execution environment

Operating system

System control and management interface

Flash memory shortened to gain space in titles, tables and block diagrams

SD memory card (https://www.sdcard.org)

Former spelling for e•MMC ('e' in italic)

Open NAND flash interface (The ONFI working group, acronym for Open NAND flash interface, was founded in 2005. The group’s mission consists in creating a common industry standard for NAND Flash interfaces, to simplify integration of NAND Flash memory into consumer electronics (CE) devices and computing platforms. ST is one of the co-founder companies together with Hynix, Intel, Micron, Phison and Sony.)

Memory technology device

Advanced Linux sound architecture

Open source software

Firmware image package is a packaging format used by TF-A

Initial ramdisk (https://en.wikipedia.org/wiki/Initial_ramdisk)

Open computing language (See http://www.opencl.org/ for more details)

Application programming interface

Network file system (https://en.wikipedia.org/wiki/Network_File_System)

Linux^® is a registered trademark of Linus Torvalds.

Arm^® is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Cortex^®

Microprocessor unit

Power management integrated circuit

Light-emitting diode

MIPI camera serial interface 2 (MIPI^® Alliance standard)

Flexible flat cable

Technology for wireless local area networking with devices based on the IEEE 802.11 standards

Display serial interface (MIPI^® Alliance standard)

Low-voltage differential signaling (related to display interfaces) - NEW

High-definition multimedia interface (HDMI standard)

Trusted firmware for Arm^® Cortex^®-A

Das U-Boot -- the universal boot loader (see U-Boot)

Open portable trusted execution environment

Device tree

Open On-Chip Debugger (See https://www.openocd.org/ for more details)

Serial peripheral interface

Real time clock

Digital Camera memory interface pixel processor

Video decoder - NEW

Graphics processing units

LCD TFT display controller (STM32 specific)

Trusted execution environment

Operating system

System control and management interface

Flash memory shortened to gain space in titles, tables and block diagrams

SD memory card (https://www.sdcard.org)

Former spelling for e•MMC ('e' in italic)

Open NAND flash interface (The ONFI working group, acronym for Open NAND flash interface, was founded in 2005. The group’s mission consists in creating a common industry standard for NAND Flash interfaces, to simplify integration of NAND Flash memory into consumer electronics (CE) devices and computing platforms. ST is one of the co-founder companies together with Hynix, Intel, Micron, Phison and Sony.)

Memory technology device

Advanced Linux sound architecture

Open source software

Firmware image package is a packaging format used by TF-A

Initial ramdisk (https://en.wikipedia.org/wiki/Initial_ramdisk)

Open computing language (See http://www.opencl.org/ for more details)

Application programming interface

Network file system (https://en.wikipedia.org/wiki/Network_File_System)

Mobile Industry Processor Interface, open membership organization that includes leading companies in the mobile industry that share the objective of defining and promoting open specifications for interfaces inside mobile terminals, see MIPI^® Alliance standard web site https://www.mipi.org

Flash memories combine high density and cost effectiveness of EPROMs with the electrical erasability of EEPROMs. For this reason, the Flash memory market is one of the most exciting areas of the semiconductor industry today and new applications requiring in system reprogramming, such as cellular telephones, automotive engine management systems, hard disk drives, PC BIOS software for Plug & Play, digital TV, set top boxes, fax and other modems, PC cards and multimedia CD-ROMs, offer the prospect of very high volume demand.

Secure digital

Multimedia card